Electronics Plating Services in Texas — Gold, Silver, and Tin

Our processes are RoHS-compliant and run under an AS9100D and ISO 9001:2015 quality system, which matters when your electronics feed aerospace, defense, or medical assemblies. In-house chemists control bath chemistry daily, and on-site laboratories at both plants verify thickness, adhesion, and conformance before parts ship.

Plating Processes for Electronics

Gold plating — MIL-DTL-45204, ASTM B488. Hard and soft gold for contacts, terminals, and RF components where low, stable contact resistance is required.
Silver plating — QQ-S-365, ASTM B700, AMS 2410/2411/2412. The highest electrical and thermal conductivity of any metal — specified for busbars, power connectors, and high-current terminals.
Tin plating — ASTM B545, MIL-T-10727. Solderable, cost-effective finishes for terminals, hardware, and stampings, rack or barrel.
Electrolytic nickel — QQ-N-290, ASTM B689, AMS 2424, MIL-P-27418. Commonly specified as a diffusion barrier underplate beneath gold, silver, and tin.
Electroless nickel — ASTM B733, MIL-C-26074, AMS 2404. Uniform, solderable deposits on complex shapes; a workhorse under-layer for electronics hardware.
Chem film (Alodine) — MIL-DTL-5541 Class 3 for aluminum enclosures and chassis needing electrical bonding surfaces with corrosion protection.
Zinc and zinc-nickel — ASTM B633; AMS 2417/ASTM B841 for enclosure hardware and brackets.
Passivation — AMS 2700, ASTM A967 for stainless connector shells and hardware.
Powder coating, wet paint, and silk screening through the Gleco family for finished enclosures — plated, coated, and marked on one purchase order.

Why Electronics Manufacturers Choose Gleco

High-mix, high-volume capability. Barrel plating for tens of thousands of terminals; rack plating for precision connector bodies — same quality system, same certs.
Nickel underplate and precious metal topcoat in one shop, eliminating a transfer step and a second supplier from your critical path.
RoHS-compliant processes documented for your compliance declarations.
In-house chemists and on-site labs controlling deposit thickness and purity, with certifications referencing the exact spec revision on your PO.
Operators certified through Gleco University, our internal training program with documented competency assessments.
Products Finishing Top Shops Elite 2024 recognition; family-owned and third generation since 1979.

Electronics Plating FAQ

What gold types and classes do you plate?

We plate gold to MIL-DTL-45204 and ASTM B488 to the type, code, and class on your drawing, including thickness verification by our on-site laboratories. Tell us the hardness and purity requirement and we will confirm capability at quote.

Do you apply a nickel barrier under gold or silver?

Yes. We plate electrolytic nickel (QQ-N-290, ASTM B689) and electroless nickel (ASTM B733) underplates in-house, which blocks copper migration into the precious metal layer and preserves solderability and contact performance.

How do you address tin whisker risk?

Whisker mitigation practices, including nickel underplating beneath tin per ASTM B545 guidance, are addressed at contract review based on your application. Discuss your reflow and reliability requirements with our team and we will document the approach on your process plan.

Can you handle both prototype quantities and production volumes?

Yes. Our lines are built for high-mix, high-volume work. We routinely run first-article and prototype lots, then scale the same documented process to production releases at either plant.

Get a Quote

Send part prints, spec callouts, base material, and annual volumes through our RFQ form. We will respond with pricing, lead time, and a recommended process stack.

Electronics Plating Services in Texas